Base materials for printed circuits ; part 3 : special materials used in connection with printed circuits ; specification 3 : permanent polymer coating materials solder resist for use in the fabrication of printed boards 印制电路用基材.第3部分:印制电路连接用特殊材料.第3号规范:制造印制电路板中用的永久性聚合物表面覆盖剂
3.
Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for permanent polymer coating materials solder resist for use in the fabrication of printed boards 印制电路用基材.第103部分:印制电路连接专用材料.第3节:制造印制电路板用永久性聚合物表面涂覆剂